the Bund of Shanghai

11th Non-Volatile Memory Technology Symposium 2011 SIMIT, Shanghai, China


The NVMTS 2011 meeting will be held at the Conference Auditorium which is located on the 3rd floor of building No.5 of Shanghai Institute of Microsystem and Information Technology (SIMIT) within walking distance of the accommodations.

Program of NVMTS2011 Download


Program of NVMTS 2011
  Sunday November 6th, 2011
  15:00-18:30 Registration
  19:00-21:00 Reception (Baguobuyi, 1018 Ding Xi Road)


  Monday November 7th, 2011
  8:30-8:40 Welcome and Opening Speech
    Chair: Stuart Parkin
Mon08:40 8:40-9:25 Keynote
Challenges and Opportunities of Data Storage Industries
Pantelis Sophoclis Alexopoulos
Data Storage Institute, A*STAR, Singapore
Mon09:25 9:25-10:10 Keynote
Advanced CMOS Development and Trend of New Class Memory
Simon Yang
Semiconductor Manufacturing International Corporation, China
  10:10-10:20 Group Photo (The Entrance of Building No.5)
  10:20-10:30 Tea Break (3rd floor of Building No.5, Corridor)
    Session 1-PCRAM 1   Chair: Simone Raoux
Mon10:30 10:30-11:15 Keynote
Toward Big Chance of PRAM Business
Hongsik Jeong
Memory Division of Samsung Electronics, Yong-in City, Kyunggi-Do, 446-711, Korea
Mon11:15 11:15-11:45 Invited
Phase Change Materials: Employing fundamental concepts of solid state physics to tailor novel electronic memories
Matthias Wuttig
Physics of Novel Materials, RWTH Aachen University of Technology, Germany
Mon11:45 11:45-12:15 Invited
Phase Change Random Access Memory: Materials and Device Integration
Zhi-Tang Song
Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China
Mon12:15 12:15-12:45 Invited
Investigation of new chalcogenide materials to improve the PCM performance
V. Sousa, L. Perniola, G. Navarro, Q.Hubert, N. Pashkov, M. Suri, E. Henaff, A. Persico, F. Fillot, F. Pierre, A. Roule, S. Maitrejean, P. Michallon, C. Vallée* H. Feldis**, C.
Jahan, J. F. Nodin, A. Toffoli, D. Blachier, A. Bastard**, J-C. Bastien, B. Hyot, B. André, G. Reimbold, P.
Zuliani***, R. Annunziata***, B. De Salvo

*CEA, LETI, MINATEC, Grenoble, France, *CNRS-LTM, Grenoble, France
**STMicroelectronics, Central R&D, Crolles, France,
*** STMicroelectronics, Agrate Brianza, Italy
  12:45-14:00 Lunch (2nd floor of Building No.5, Canteen)
    Session 2-MRAM   Chair: Jian-Ping Wang
Mon14:00 14:00-14:45 Keynote
Racetrack Memory: A High-Performance, Storage Class Memory Using Magnetic Domain-Walls Manipulated by Current
Stuart Parkin
IBM Research Division, Almaden Research Center, San Jose, California, USA
Mon14:45 14:45-15:15 Invited
Embedded MRAM Technology for Logic VLSI Application
N. Kasai1*, S. Ikeda1,2, T. Hanyu1,3, T. Endoh1,4, H. Ohno1,2
1. Center for Spintronics Integrated Systems, Tohoku University, Sendai, Japan
2. Laboratory for Nanoelectronics and Spintronics, Research Institute of Electrical Communication, Tohoku University,Sendai, Japan
3. Laboratory for Brainware Systems, Research Institute of Electrical Communication, Tohoku University, Sendai, Japan
4. Center for Interdisciplinary Research, Tohoku University, Sendai, Japan
Mon15:15 15:15-15:45 Invited
Nano-elliptic-ring shaped magnetic tunnel junctions and their applications in MRAM designs
Xiu-Feng Han
Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Science, Beijing 100190, China
Mon15:45 15:45-16:15 Invited
Spin-RAM for Normally-Off Computer
K. Ando¹*, T. Kai², T. Kishi², N. Shimomura², H. Aikawa², M.Yoshikawa², T. Nagase², K. Nishiyama², E. Kitagawa², T. Daibou², M. Amano², S. Takahashi², M. Nakayama², S. Ikegawa², M. Nagamine², J. Ozeki², D. Watanabe², K.Yakushiji¹, H. Kubota¹, A. Fukushima¹, S. Yuasa¹, T. Nozaki¹,³, Y. Suzuki³, M. Oogane4;, S. Mizukami4;, Y. Ando4;, Y. Nakatani4;, T. Miyazaki4; and H. Yoda²
1. National Institute of Advanced Industrial Science and Technology (AIST), 2. Toshiba, 3. Osaka University, 4. Tohoku University, 5. The University of Electro-Communications
  16:15-16:30 Tea Break (3rd floor of Building No.5, Corridor)
    Session 3-FeRAM   Chair: Junji Tominaga
     
Mon16:30 16:30-17:15 Keynote
Overview of FeRAMs: Trends and Perspectives
Daisaburo Takashima
Center for Semiconductor Research & Development, Semiconductor & Storage Products Company, Toshiba Corp., 2-5-1, Kasama, Sakae-ku, Yokohama 247-8585, Japan
Mon17:15 17:15-17:45 Invited
Current Status of Ferroelectric Random Access Memories
Hiroshi Ishiwara
Department of Physics, Division of Quantum Phases and Devices, Konkuk University, Seoul 143-701, Republic of Korea
  18:00-21:00 Banquet (Music Restaurant, 438 Wu Yi Road )


  Tuesday November 8th, 2011
    Session 4-RRAM 1   Chair: J. Suñé
Tue08:30 8:30-9:15 Keynote
Promises and challenges of Memristive switches
J. Joshua Yang
HP Labs, Palo Alto, CA 94304, USA
Tue09:15 9:15-9:45 Invited
Metal Oxide Hetero Junction Nonvolatile Memory
Dongmin Chen
4DS Inc., USA
Tue09:45 9:45-10:15 Invited
Self-Rectifying Unipolar HfOx Based RRAM Built by Fab-Available Materials
Hong-Yu Yu*, X.A. Tran
School of EEE, Nanyang Technological University,50 Nanyang Avenue, Singapore 639798
  10:15-10:30 Tea Break (3rd floor of Building No.5, Corridor)
    Session 5-Flash 1   Chair: Daisaburo Takashim
Tue10:30 10:30-11:15 Keynote
Flash Memory: the Journey Continues
Stefan K Lai
Xinnova Technology Ltd., Shanghai, China
Tue11:15 11:15-11:45 Invited
Highly reliable Low Power Storage Class Memory & NAND Flash Memory Hybrid Solid-State Drive (SSD)
Ken Takeuchi
Dept. of Electrical Engineering and Information Systems, University of Tokyo, Tokyo, Japan
Tue11:45 11:45-12:15 Invited
Overview of Charge-Trapping NAND Flash and 3D NAND Flash
Hang-Ting Lue
Nano Technology R&D Dept. (ME110)/Emerging Central Lab, Macronix International Co., Ltd,, Taiwan
  12:30-14:00 Lunch (2nd floor of Building No.5, Canteen)
Posters Displayed
  14:00-16:00 Poster Session    Chair: Hong-Yu Yu & Bo Liu
    Session 6–New Concepts   Chair: Dong-Min Chen
Tue16:00 16:00-16:45 Keynote
Optimization of SSDs and Systems and the Value of Better NVM
Rick Coulson
Storage Technologies Group, Intel Corporation, Hillsboro, Oregon 97229 USA
Tue16:45 16:45-17:15 Invited
Bio Inspired Artificial Cognitive Memory
L.P. Shi1, K.J. Yi1, Kiruthika Ramanathan1, N.Ning1, R. Zhao1, H.Z.Li2, and Z. Yang3
1. Data Storage Institute, A*STAR (Agency for Science, Technology and Research), Singapore 117608
2. Institute for Infocomm Research, A*STAR (Agency for Science, Technology and Research), Singapore 138632
3. Electrical computer engineering department, National University of Singapore, Singapore 117576
Tue17:15 17:15-17:45 Invited
MTJ-Based Nonvolatile Logic-in-Memory Architecture and Its Application
Takahiro Hanyu1,2
1. Center for Spintronics Integrated Systems, Tohoku University, Sendai, Japan
2. Laboratory for Brainware Systems, Research Institute of Electrical Communication, Tohoku University, Sendai, Japan
Tue17:45 17:45-18:15 Invited
Magnetic Logic and Computation using Magnetic Tunnel Junctions
Jian-Ping Wang
University of Minnesota, USA
  18:15-19:30 Dinner (Yongxiang Restaurant, 1271 Ding Xi Road)
  19:45 The Bund Tour


  Wednesday  November 9th, 2011
    Session 7-PCRAM 2    Chair: Andrea Lacaita
Wed08:30 8:30-9:15 Keynote
Phase-change memories: new features to catch opportunities in the memory market
Agostino Pirovano, Robert Bez
Micron Technology, Inc., Italy
Wed09:15 9:15-9:45 Invited
Materials Engineering for PCRAM
Simone Raoux1*, Huai-Yu Cheng2 and Jury Sandrini3
1. IBM/Macronix PCRAM Joint Project, IBM T. J. Watson Research Center, Yorktown Heights, NY 10598, USA
2. IBM/Macronix PCRAM Joint Project, Macronix Emerging Central Lab., Macronix International Co., Ltd. 16 Li-Hsin Rd. Science Park, Hsinchu, Taiwan
3. Turin Polytechnic University, Turin, Italy
Wed09:45 9:45-10:15 Invited
Entropy-controlled phase-change memory
Junji Tominaga*, P. Fons and A. Kolobov
Green Nanoelectronics Center, Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology, AIST, Tsukuba Central 4, 1-1-1 Higashi, Tsukuba, 305-8562, Japan
  10:15-10:30 Tea Break (3rd floor of Building No.5, Corridor)
    Session 8-Flash 2/RRAM 2   Chair: Hang-Ting Lue
Wed10:30 10:30-11:00 IInvited
Charge-trapping based next generation High-performance nonvolatile memory
Ming Liu
Institute of Microelectronics of Chinese Academy of Sciences, China
Wed11:00 11:00-11:30 Invited
High Performance Charge-Trapping Flash Memory with Highly-Scaled Trapping Layer
Albert Chin1*, C. Y. Tsai1, and Hong Wang2
1. Dept. of Electronics Eng., National Chiao-Tung University, Hsinchu, Taiwan
2. School of Electrical & Electronic Engineering, Nanyang Technological University, Singapore
Wed11:30 11:30-12:00 Invited
Logic-based Mega-bit CuxSiyO emRRAM with Excellent Reliability and Scalability
Lin Yinyin1*, Yang Lingming1, Song Yali1, Wang Yanliang1 , Huang Ryan2, Zou Qingtian2 and Wu Jingang2
1. ASIC and System State Key Laboratory Dept. Microelectronics, Fudan University Shanghai, 201203, China;
2. Technology Research & Development Center Semiconductor Manufacturing International Corp. Shanghai, 201203, China
Wed12:00 12:00-12:30 Invited
From failure to function: learning from dielectric breakdown for improved understanding of resistive switching memories
J. Suñé1*, S. Long1, 2, E. Miranda1, D. Jiménez1 and M. Liu2
1. Departament d’Enginyeria Electrònica, Universitat Autònoma de Barcelona, 08193 Bellaterra, Spain
2. Laboratory of Nano-Fabrication and Novel Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, 100029 Beijing, China
  12:30-14:00 Lunch (2nd floor of Building No.5, Canteen)
    Session 9-PCRAM 3    Chair:De Salvo Barbara
Wed14:00 14:00-14:30 Invited
Electrical properties and microscopic structure of amorphous chalcogenides
D. Ielmini and A. L. Lacaita(1)*
Dipartimento di Elettronica e Informazione and IU.NET, Politecnico di Milano, Piazza L. da Vinci, 32 – 20133 Milano, Italy
(1) also with IFN-CNR, Milano, Italy
Wed14:30 14:30-15:00 Invited
MOCVD GST for High Speed and Low Reset Current Phase Change Memory Applications
J. F. Zheng*1, J. Reed2, J. Ricker2, W. Czubatyj2, C. Schell2, R. Sandoval2, P. Chen1, W. Hunks1, W. Li1, J. Cleary1, S. Hudgens2, C. Dennison2, T. Lowrey2
1. ATMI Inc., 7 Commerce Drive, Danbury, CT 06810, USA
2. Ovonyx Inc., Troy, MI 48083
Wed15:00 15:00-15:30 Invited
Tool and process developments for emerging NVRAM
Koukou Suu
Institute of Semiconductor and Electronics Technologies, ULVAC, Inc.
Susono, Shizuoka, 410-1231 Japan
  15:30-15:45 Tea Break (3rd floor of Building No.5, Corridor)
Wed15:45 15:45-16:15 Invited
Hybrid SSD with PCRAM
Xiaohua Cheng, Chuangshi Zhou, Yining Liu*
R&D Department, Netac Technology Co., Ltd., China
Wed16:15 16:15-16:45 Invited
Phase Change Memory – Its Opportunities and Challenges
Ming-Hsiu Lee
Macronix Emerging Central Lab, Macronix International, Taiwan
Wed16:45 16:45-17:15 Invited
Amorphisation of GeTe-based phase-change memory alloys
A.V. Kolobov, P. Fons, M. Krbal, and J. Tominaga
Nanoelectronics Research Institute and Green Nanoelectronics Center, National Institute of Advanced Industrial Science and Technology, Tsukuba Central-4, 1-1-1 Higashi, Tsukuba, Ibaraki 305-8562, Japan
  17:15-17:30 Closing Remark (Matthias Wuttig)
    End of Conference

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